Medallion Technology: high density interconnects, 3D interconnects, solderless interconnects, PCB interconnects


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High density interconnect tool for electronic circuit board assembly.

  • High Density
  • High Speed
  • Short Signal Path
  • Controllable Impedance
  • Maintain Signal Integrity


Our Product


We produce and supply manufacturing with TWI’s ready for use in their applications.  TWI’s are automatically loaded into cartridges during manufacturing and delivered to the end user for seamless introduction into the assembly system.

Our Systems


We design and produce TWI assembly equipment to fit your manufacturing volume.  From semi-automated to fully automated, we can integrate into your manufacturing environment.